4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With separate tie bar element or plural tie bars

Hyung-Jun Park

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Leadless leadframe with an improved die pad for mold locking

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Method for fabricating leadless packages with mold locking...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method for forming leadless semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Process and lead frame for making leadless semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Process and lead frame for making leadless semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2936629

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