Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-01-30
2007-01-30
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S113000, C438S464000
Reexamination Certificate
active
10915367
ABSTRACT:
A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. After a wire bonding step and an encapsulating step are conducted, a portion of each lead of the lead frame is etched away to form a first connection pad and a second connection pad which are separated from each other but are still electrically connected to each other via the first metal layer therebetween. Then, a second metal layer is electroplated on the connection pads and the die pads by using the first metal layer as an electrical path. Finally, the first metal layer between the first connection pads and the second connection pads is removed, and a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.
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Kim Hyeong-No
Lee YongGil
Park Hyung-Jun
Park Sang-Bae
Rho Kyung-Soo
Advanced Semiconductor Engineering Inc.
Barnes Seth
Pillsbury Winthrop Shaw & Pittman LLP
Wilczewski M.
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