Method for forming leadless semiconductor packages

Details Method for forming leadless semiconductor packages Method for forming leadless semiconductor packages

2006-08-08

2006-08-08

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S461000, C438S508000, C257S666000

Reexamination Certificate

active

07087462

ABSTRACT:
The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.

REFERENCES:
patent: 6933594 (2005-08-01), McLellan et al.

Affiliated with

Also associated with

Rating

Method for forming leadless semiconductor packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming leadless semiconductor packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming leadless semiconductor packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3610543