Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-08
2006-08-08
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S123000, C438S124000, C438S127000, C257SE23061
Reexamination Certificate
active
07087461
ABSTRACT:
A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. Each lead of the lead frame has a first portion, a second portion and a third portion connecting the first portion and the second portion, wherein the first metal layer is not provided on the third portion. After a wire bonding step and an encapsulating step are conducted, a second metal layer is selectively plated on the first portions and the second portions of the leads and the die pads exposed from the bottom of the molded product. Then, the third portion of each lead is selectively etched away such that the first portion and the second portion are electrically isolated from each other. Finally, a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.
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Kim Hyeong-No
Lee YongGil
Park Hyung-Jun
Park Sang-Bae
Rho Kyung-Soo
Advanced Semiconductor Engineering Inc.
Bednarek Michael
Parekh Nitin
Pillsbury Winthrop Shaw & Pittman LLP
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