4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Hyeong-No Kim

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Hybrid carrier and a method for making the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Process and lead frame for making leadless semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Process and lead frame for making leadless semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Stacked type chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2233323

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