Hybrid carrier and a method for making the same

Details Hybrid carrier and a method for making the same Hybrid carrier and a method for making the same

2011-05-10

2011-05-10

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S676000, C257SE23043, C257SE21502

Reexamination Certificate

active

07939379

ABSTRACT:
A hybrid carrier and a method for making the same, wherein the hybrid carrier has a plurality of interconnection leads, so that a wire bondable semiconductor device or a flip chip die apparatus can be placed on the hybrid carrier, and is electrically connected to die paddle and bond fingers. Also, it is easy to dispose a semiconductor device on the hybrid carrier and easy to electrically bond the hybrid carrier and the semiconductor device. Therefore, the hybrid carrier and the method for making the same can be applied to an area array metal CSP easily, and the method is simple, so the production cost can be reduced.

REFERENCES:
patent: 2006/0255009 (2006-11-01), Card et al.
patent: 2009/0140415 (2009-06-01), Furuta
patent: 05283859 (1993-10-01), None
patent: 2004031710 (2004-01-01), None

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