4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Coating predominantly semiconductor substrate

Hung-Wen Su

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Damascene interconnect structure with cap layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Method and apparatus for fabricating metal layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method for copper surface smoothing

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method for reducing surface defects in an electrodeposition...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Reexamination Certificate

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Method of fabricating semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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