4. Metal fusion bonding
  5. Process
  6. Plural joints

Howard R. Test

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Capillary designs and process for fine pitch ball bonding

Metal fusion bonding – Process – Plural joints
Patent

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Copper-metallized integrated circuits having electroless...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for making an IC device using a single-headed bonder

Metal fusion bonding – Process – Plural joints
Patent

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Method to achieve continuous hydrogen saturation in...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method to achieve continuous hydrogen saturation in...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1193062

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