Method for making an IC device using a single-headed bonder

Details Method for making an IC device using a single-headed bonder Method for making an IC device using a single-headed bonder

1997-05-29

1999-11-09

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 45, 228 495, H01L 2160

Patent

active

059797436

ABSTRACT:
A method of using a single-headed bonder (80) to form bonds to bond pads (16) is provided. A single-headed bonder (80) includes a capillary (22) having a capillary face (40) with a long dimension along a first axis (BB) and a short dimension along a second axis (CC). The long dimension of the capillary face (40) is aligned in a first orientation such that the bond pads (16) are bonded in a first direction associated with the first orientation. The capillary (22) is then rotated to place the long dimension in a second orientation such that all the bond pads (16) are bonded in a second direction associated with the second orientation. In place of rotating the capillary (22), a second single-headed bonder (90) having a capillary (22) rotated to the second orientation can be used to bond bond pads (16) in the second direction. Transportation between bonders can be done manually, by a transport mechanism (60), by a robotic arm (70), or other suitable means.

REFERENCES:
patent: 5465899 (1995-11-01), Quick et al.
patent: 5544804 (1996-08-01), Test et al.

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