4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Hilton T. Toy

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Adhesion promoting layer for bonding polymeric adhesive to metal

Heat exchange – With retainer for removable article – Electrical component
Patent

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Apparatus and methods for cooling semiconductor integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Apparatus and methods for high-performance liquid cooling of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Apparatus for controlling thermal interface gap distance

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Cast metal seal for semiconductor substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-197677

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