Adhesion promoting layer for bonding polymeric adhesive to metal

Details Adhesion promoting layer for bonding polymeric adhesive to metal Adhesion promoting layer for bonding polymeric adhesive to metal

1997-07-30

1999-08-03

Lazarus, Ira S.

Heat exchange

With retainer for removable article

Electrical component

165905, 165185, 257722, 361697, 361706, 361708, 428450, F28F 700

Patent

active

059312220

ABSTRACT:
A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.

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