Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-13
2010-10-05
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679530, C361S679540, C361S702000, C361S704000, C361S719000, C165S104330, C257S714000
Reexamination Certificate
active
07808781
ABSTRACT:
Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.
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Colgan Evan George
Gaynes Michael Anthony
Magerlein John Harold
Marston Kenneth Charles
Schmidt Roger Ray
Gandhi Jayprakash N
Hoffberg Robert J
International Business Machines - Corporation
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