4. Semiconductor device manufacturing: process
  5. Including control responsive to sensed condition
  6. Interconnecting plural devices on semiconductor substrate

Hideyuki Fukuhara

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Apparatus and method for estimating chip yield

Boots – shoes – and leggings
Patent

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Circuit for reducing stand-by current induced by defects in memo

Static information storage and retrieval – Powering – Data preservation
Patent

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Fuse in top level metal and in a step, process of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Method for fabricating a semiconductor device with laser program

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Patent

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Method of making fuse with non-corrosive termination of corrosiv

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-291226

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