Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Drop-mold conformable material as an encapsulation for an...
Embedded semiconductor die package and method of making the...
Encapsulant interposer system with integrated passive...
Integrated circuit package in package system
Integrated circuit package on package system
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Profile ID: LFUS-PAI-P-2156498