Embedded semiconductor die package and method of making the...

Details Embedded semiconductor die package and method of making the... Embedded semiconductor die package and method of making the...

2008-11-06

2010-11-30

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S678000, C438S680000, C257SE21170, C257SE21094, C257SE21237, C257SE21499, C257SE21502, C257SE21503, C257SE21508, C257SE21509, C257SE21517

Reexamination Certificate

active

07842542

ABSTRACT:
An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each having a lead frame interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the lead frame interconnect structure and encapsulant. The package interconnect structure and lead frame interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the lead frame interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the lead frame interconnect structure.

REFERENCES:
patent: 5250843 (1993-10-01), Eichelberger
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 7439100 (2008-10-01), Fauty et al.
patent: 7598600 (2009-10-01), Tang et al.
patent: 7619901 (2009-11-01), Eichelberger et al.

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