Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-11-21
2010-11-30
Picardat, Kevin M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S667000, C257S670000, C257S672000, C257S686000, C257S690000, C257S691000, C257S692000, C257S693000, C257S723000, C257S724000, C257S735000, C257S773000, C257S778000
Reexamination Certificate
active
07843047
ABSTRACT:
A method of manufacturing a semiconductor package system including: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
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Chow Seng Guan
Huang Rui
Kuan Heap Hoe
Lin Yaojian
Au Bac H
Ishimaru Mikio
Picardat Kevin M
Stats Chippac Ltd.
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