Integrated circuit package in package system

Details Integrated circuit package in package system Integrated circuit package in package system

2011-07-19

2011-07-19

Graybill, David E (Department: 2894)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S017000, C438S109000, C438S123000, C438S124000

Reexamination Certificate

active

07981702

ABSTRACT:
An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.

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