4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Harold W. Moyer

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Assembling an electronic device

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Electronic component package using multi-level lead frames

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Plastic integrated circuit package

Patent

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Semiconductor integrated circuit packages

Patent

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Semiconductor integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Profile ID: LFUS-PAI-P-336717

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