Semiconductor integrated circuit packages

Details Semiconductor integrated circuit packages Semiconductor integrated circuit packages

1992-02-18

1993-06-01

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257674, 257676, H01L 2348, H01L 2944

Patent

active

RE0342696

ABSTRACT:
A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.

REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 4477827 (1984-10-01), Walker et al.

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