Semiconductor integrated circuit packages

Details Semiconductor integrated circuit packages Semiconductor integrated circuit packages

1986-11-24

1989-02-07

Edlow, Martin H.

357 69, H01L 2348

Patent

active

048035408

ABSTRACT:
A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.

REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 4477827 (1984-10-01), Walker et al.

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