Plastic integrated circuit package

Details Plastic integrated circuit package Plastic integrated circuit package

1984-06-04

1986-09-16

James, Andrew J.

357 68, H01L 2340, H01L 2312

Patent

active

046125647

ABSTRACT:
The specification describes an integrated circuit package with a lead frame that incorporates crossunder members for power distribution. It uses a paddle member for chip support and back plane contact, with crossunders extending alongside the paddle. Insulating means is interposed between the chip and the lead frame with an opening to allow contact from the chip to the paddle.

REFERENCES:
patent: 4417266 (1983-11-01), Grabbe

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