4. Coating processes
  5. Measuring, testing, or indicating

George Eugene White

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Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method for repairing defective electrical connections on multi-l

Coating processes – Measuring – testing – or indicating
Patent

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Method for repairing defective electrical connections on multi-l

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Minimal capture pads applied to ceramic vias in ceramic substrat

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
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Profile ID: LFUS-PAI-P-120198

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