Minimal capture pads applied to ceramic vias in ceramic substrat

Details Minimal capture pads applied to ceramic vias in ceramic substrat Minimal capture pads applied to ceramic vias in ceramic substrat

1995-05-25

1999-06-29

Nuzzolillo, Maria

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

430296, 430311, 430315, H01B 1300

Patent

active

059164514

ABSTRACT:
A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.

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Dougherty, W.E. "Misregistration Compensation in Multilayer Structures", IBM Technical Disclosure Bulletin, vol. 22, No. 12, May 1980.
European Search Report dated Jun. 22, 1995.
Athawes, W.H., Bucek, A., "MC Substrate Chrome Artwork Mask" IBM Technical Disclosure Bulletin, vol. 24, No. 3, Aug. 1981.

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