Coating processes – Measuring – testing – or indicating
Patent
1997-02-14
1998-05-05
Pianalto, Bernard
Coating processes
Measuring, testing, or indicating
427 96, 427123, 427261, 427282, 427404, B05D 512
Patent
active
057470952
ABSTRACT:
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
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IBM Technical Disclosure Bulletin, vol. 20, No. 9 Feb. 1978 C.W. Ho and C.Y. Ting, Planar Wiring Repair Technique for the Thin-Film Metal Package Via Solder Evaporation, vol. 20, No. 9, IBM Corp. 1978, pp. 3729-3730.
McAllister Michael
McDonald James
Perfecto Eric Daniel
Prasad Chandrika
Prasad Keshav
Ahsan Aziz M.
International Business Machines - Corporation
Pianalto Bernard
Tomaszewski John J.
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