Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1995-12-21
1998-05-26
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257748, 257758, 257 48, H01L 2348, H01L 2352, H01L 2940, H01L 2358
Patent
active
057570795
ABSTRACT:
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
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IBM Technical Disclosure Bulletin, vol. 20, No. 9 Feb. 1978 C.W. Ho and C. Y. Ting, Planar Wiring Repair Technique for the Thin-Film Metal Package Via Solder Evaporation, vol. 20, No. 9, IBM Corp. 1978, pp. 3729-3730.
McAllister Michael
McDonald James
Perfecto Eric Daniel
Prasad Chandrika
Prasad Keshav
Ahsan Aziz M.
Clark Jhihan B.
International Business Machines - Corporation
Saadat Mahshid D.
Tomaszewski John J.
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