4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Franz Kloucek

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Apparatus for manufacturing a laminar bond

Metal fusion bonding – Including means to force or clamp work portions together...
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Cooled high-power semiconductor device

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
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Fast power semiconductor circuit

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Method for manufacturing a laminar bond and apparatus for conduc

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Method for manufacturing semiconductor components

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-240299

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