Apparatus for manufacturing a laminar bond

Details Apparatus for manufacturing a laminar bond Apparatus for manufacturing a laminar bond

1989-03-16

1989-10-24

Ramsey, Kenneth J.

Metal fusion bonding

Including means to force or clamp work portions together...

29238, B23K 3704

Patent

active

048756130

ABSTRACT:
In a method for the firm bonding at elevated temperatures of thin, large-area wafers of different thermal expansion the deformations of the laminar bond occurring later during cooling are at least partially compensated by an appropriate pre-deformation in the opposite direction. An apparatus for conducting the method uses the different thermal expansion of a housing (1) and a ring-shaped thermal expansion element (3) to produce the pre-deformation.

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patent: 4271577 (1981-06-01), Kosugi
patent: 4607779 (1986-08-01), Burns
Brazing Manual American Welding Society, Inc. Miami, Fla. 1976 pp. 123-239.
Wittmer et al Journal American Ceramic Soc., vol. 65, No. 3, Mar. 1982, pp. 149-153.

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