Cooled high-power semiconductor device

Details Cooled high-power semiconductor device Cooled high-power semiconductor device

1991-01-24

1992-07-21

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 79, 357 82, 361385, 361386, 361388, H01K 2302, H01K 2342

Patent

active

051327775

ABSTRACT:
In a cooled high-power semiconductor device, the cooling is improved as a result of the fact that contact filaments (3a,b) which are arranged in brush form and which form cooling channels (11a,b) between them through which a coolant flows make contact with the semiconductor substrate (1) by a materially continuous joint.

REFERENCES:
patent: 2849665 (1958-08-01), Boyer et al.
patent: 3397278 (1968-08-01), Pomerantz
patent: 3746947 (1973-07-01), Yamamoto et al.
patent: 4183042 (1980-01-01), Novak et al.
patent: 4333102 (1982-06-01), Jester et al.
patent: 4392153 (1983-07-01), Glascock, II et al.
patent: 4402004 (1983-08-01), Iwasaki
patent: 4559580 (1985-12-01), Lutty

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