Method for manufacturing semiconductor components

Details Method for manufacturing semiconductor components Method for manufacturing semiconductor components

1988-03-22

1989-08-15

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228102, 228242, 228243, 22826312, 219209, 219 8513, 29879, B23K 104

Patent

active

048567027

ABSTRACT:
In a method for manufacturing an alloy contact between a wafer-shaped semiconductor substrate (4) and a metal contact wafer (6) a material bond for which the alloy layer reaches only slightly into the interior of the semiconductor substrate (4) is achieved by individually heating the layer arrangement of semiconductor substrate (4) and contact wafer (6) and by means of thermal radiation in a vacuum and by using panel heating elements (13, 17) whose area is larger than the area of the layer arrangement.

REFERENCES:
patent: 4098452 (1978-07-01), Webster et al.
patent: 4358784 (1982-11-01), Wislocky et al.
patent: 4469529 (1984-09-01), Mimura

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