Method for manufacturing a laminar bond and apparatus for conduc

Details Method for manufacturing a laminar bond and apparatus for conduc Method for manufacturing a laminar bond and apparatus for conduc

1988-03-15

1989-05-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228212, 22826312, 29446, B23K 104

Patent

active

048322539

ABSTRACT:
In a method for the firm bonding at elevated temperatures of thin, large-area wafers of different thermal expansion the deformations of the laminar bond occurring later during cooling are at least partially compensated by an appropriate pre-deformation in the opposite direction. An apparatus for conducting the method uses the different thermal expansion of a housing (1) and a ring-shaped thermal expansion element (3) to produce the pre-deformation.

REFERENCES:
patent: 3220091 (1965-11-01), Reef
patent: 3794541 (1974-02-01), Schissler
Brazing Manual, American Welding Society, Inc., Miami, Fla., 1976, pp. 235-239.
Wittmer et al, Journal American Ceramic Soc., vol. 65, No. 3, Mar. 1982, pp. 149-153.

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