4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Frank Kuechenmeister

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Efficient method of forming and assembling a microelectronic...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for decreasing surface delamination of gel-type...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for forming solder balls with a stable oxide layer by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor chip with reinforcement layer and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Semiconductor device including a reduced stress...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2283267

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