Efficient method of forming and assembling a microelectronic...

Details Efficient method of forming and assembling a microelectronic... Efficient method of forming and assembling a microelectronic...

2005-08-15

2009-02-17

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257SE21522

Reexamination Certificate

active

07491556

ABSTRACT:
The present invention provides a new technology approach for forming a contact layer in a microelectronic chip, which includes a plurality of solder bumps that are directly to be connected with a correspondingly designed carrier substrate. In the process flow, a plasma-based process for patterning the underbump metallization layer is used in combination with testing and assembling the device, thereby providing a high degree of process flexibility and/or cost reduction and/or device performance.

REFERENCES:
patent: 6413851 (2002-07-01), Chow et al.
patent: 6501185 (2002-12-01), Chow et al.
patent: 6624060 (2003-09-01), Chen et al.
patent: 6941957 (2005-09-01), Chen et al.
patent: 7015130 (2006-03-01), Tsai et al.
patent: 7329951 (2008-02-01), Daubenspeck et al.
patent: 7348210 (2008-03-01), Daubenspeck et al.
patent: 2004/0110364 (2004-06-01), Tsai et al.
patent: 2004/0166661 (2004-08-01), Lei
patent: 0 951 069 A 1 (1999-10-01), None
patent: 2003023022 (2003-01-01), None

Affiliated with

Also associated with

Rating

Efficient method of forming and assembling a microelectronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Efficient method of forming and assembling a microelectronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Efficient method of forming and assembling a microelectronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4087679