Method for decreasing surface delamination of gel-type...

Details Method for decreasing surface delamination of gel-type... Method for decreasing surface delamination of gel-type...

2007-09-15

2010-11-16

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S118000, C257S706000, C257S720000, C257SE23104, C257SE23106

Reexamination Certificate

active

07833839

ABSTRACT:
Various methods and apparatus for establishing a thermal pathway for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes placing a gel-type thermal interface material in a preselected pattern on a semiconductor chip that is coupled to a substrate. The preselected pattern of gel-type thermal interface material is allowed to partially set up. Additional thermal interface material is placed on the semiconductor chip and cured.

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USPTO Office Action mailed May 18, 2009; U.S. Appl. No. 11/846,618.

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