Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-03-01
2011-03-01
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S643000, C257S701000, C257S738000, C257S792000
Reexamination Certificate
active
07897433
ABSTRACT:
Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a side and forming a polymer layer on the side. The polymer layer has a central portion and a first frame portion spatially separated from the central portion to define a first channel. An underfill material may be provided to invade the channel and establish a mechanical joint between the polymer layer and the underfill material.
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Bravo Jaime
Kuechenmeister Frank
Su Michael
Advanced Micro Devices , Inc.
Chambliss Alonzo
Honeycutt Timothy M.
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