4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Francis Heap Hoe Kuan

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Leaded stacked packages having elevated die paddle

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Leaded stacked packages having elevated die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leaded stacked packages having integrated upper lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor assembly with component attached on die back side

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Semiconductor assembly with component pads attached on die...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2290993

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