Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-05-31
2011-05-31
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257SE23085, C257S786000, C257S528000, C257S532000, C257S690000, C257S728000, C257S725000, C257S685000, C257S686000, C257S723000, C257S777000
Reexamination Certificate
active
07952211
ABSTRACT:
One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be soldered to signal routes on the back side of the die, the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections. Placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die's package.
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Chow Seng Guan
Kuan Francis Heap Hoe
Stats Chippac, Inc.
Williams Alexander O
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