Semiconductor assembly with component attached on die back side

Details Semiconductor assembly with component attached on die back side Semiconductor assembly with component attached on die back side

2006-09-14

2009-11-24

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23085, C257S786000, C257S528000, C257S532000, C257S690000, C257S728000, C257S725000, C257S685000, C257S686000, C257S723000, C257S777000

Reexamination Certificate

active

07622811

ABSTRACT:
One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be soldered to signal routes on the back side of the die, the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections. Placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die's package.

REFERENCES:
patent: 6342724 (2002-01-01), Wark et al.
patent: 6768190 (2004-07-01), Yang et al.
patent: 7005325 (2006-02-01), Chow et al.
patent: 2008/0258259 (2008-10-01), Osaka et al.
patent: 2008/0299709 (2008-12-01), Corisis et al.
patent: 2008/0305582 (2008-12-01), Fillion et al.
patent: 2008/0315356 (2008-12-01), Reisner
Sturcken et al., “Advanced Packaging, Cover Story: Bare Chip Stacking,”Advanced Packaging Magazine, 5 pages, Apr. 2003 <http://ap.pennnet.com/Articles/Article—Display.cfm?Section=Archives&Subsection=Display&ARTICLE—ID=172233>.

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