4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Edward O. Travis

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Die level metal density gradient for improved flip chip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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EPI T-gate structure for CoSi 2 extendibility

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
Reexamination Certificate

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Integrated assist features for epitaxial growth

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Integrated assist features for epitaxial growth bulk/SOI...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Integrated circuit having structural support for a flip-chip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-908521

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