4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Edward L. Malantonio

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Cantilever probe structure for a probe card assembly

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method and apparatus for producing co-planar bonding pads on...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and apparatus for producing co-planar bonding pads on...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of shaping lithographically-produced probe elements

Electric heating – Metal heating – By arc
Reexamination Certificate

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Probe repair methods

Metal working – Method of mechanical manufacture – Repairing
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Profile ID: LFUS-PAI-P-2376389

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