Method and apparatus for producing co-planar bonding pads on...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S620000

Reexamination Certificate

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11190092

ABSTRACT:
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.

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Patent Cooperation Treaty, “Notification Concerning Transmittal of International Preliminary Report on Patentability,” PCT/US2005/026385, dated Feb. 8, 2007, 8 pages.
Current Claims, PCT/US2005/026385, 2 pages (attached).

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