Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-01
2008-07-01
Lebentritt, Michael S. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S620000
Reexamination Certificate
active
07393773
ABSTRACT:
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
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Hanoon Ilan
Laurent Edward
Malantonio Edward L.
Hickman Palermo Truong & Becker
Lebentritt Michael S.
Nikmanesh Seahvosh J
SV Probe PTE Ltd.
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