4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Dirk Brown

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Copper interconnect methodology for enhanced electromigration re

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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Dielectric adhesion enhancement in damascene process for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual barrier and conductor deposition in a dual damascene proces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Dual barrier and conductor deposition in a dual damascene...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Manufacturing method for semiconductor metalization barrier

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-207124

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