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Deepak Swamy

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Ceramic integrated circuit package with optional IC removably mo

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Circuit board having an improved fine pitch ball grid array and

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Circuit board thermal relief pattern having improved electrical

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Circuit board-mounted IC package cooling and method

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
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Circuit board-mounted IC package cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
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Profile ID: LFUS-PAI-P-563587

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