Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1996-11-22
1999-08-31
Graybill, David
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 51, 438 55, 438122, 438124, 438126, H01L 2152, H01L 2154, H01L 2158
Patent
active
059465441
ABSTRACT:
In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.
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Estes Scott
Swamy Deepak
Dell USA L.P.
Graybill David
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