Ceramic integrated circuit package with optional IC removably mo

Details Ceramic integrated circuit package with optional IC removably mo Ceramic integrated circuit package with optional IC removably mo

1995-09-05

1998-11-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361783, 257697, 257777, 439 69, 174 521, 174260, 174264, H05K 702, H05K 710, H01L 2352

Patent

active

058353577

ABSTRACT:
A ceramic package for an integrated circuit (IC) and a method of manufacturing the ceramic package. The package comprises: (1) a ceramic body having opposing substantially planar first and second surfaces thereon, a cavity in the body and a plurality of vias passing through the body and intercepting the first and second surfaces, (2) an integral IC located within the cavity, (3) a plurality of electrical conductors located on the surfaces, passing through the plurality of vias and coupled to the IC, the plurality of conductors adapted to allow communication of electrical signals through the body and with the IC and (4) first and second electrical connectors located on the first and second surfaces, respectively, the first electrical connector allowing an optional IC to be removably mounted to the package and coupled to the plurality of electrical conductors, the second electrical connector allowing the package to be mounted to a supporting circuit board, the package thereby allowing the integral and optional ICs to communicate the electrical signals therebetween and with the circuit board.

REFERENCES:
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5384692 (1995-01-01), Jaff
patent: 5412537 (1995-05-01), Magill et al.
patent: 5612657 (1997-03-01), Kledzik

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