Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-03-14
1995-10-31
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174256, 174257, 174260, 361767, H05U 100
Patent
active
054631912
ABSTRACT:
A circuit board design featuring a fine pitch ball grid array ("BGA") having a simplified construction. The circuit board comprises: (1) an insulating substrate, the substrate having a via therethrough, (2) a conductive layer located over the substrate, the via passing through the layer and laterally uninterrupted through the circuit board, (3) a first solder having a first melting point located within and substantially blocking the via and (4) a second solder having a second melting point located over the blocked via, the second melting point lower than the first melting point, the first solder remaining substantially solid and preventing the second solder from substantially entering the via when the first and second solders are heated to a temperature between the first and second melting points. The present invention eliminates precision drilling required by current blind via BGA pad designs.
REFERENCES:
patent: 5147084 (1992-09-01), Behun et al.
patent: 5180440 (1993-01-01), Siegel et al.
Bell James S.
Swamy Deepak
Dell USA L.P.
Figlin Cheryl R.
Hitt David
Huffman James
Picard Leo P.
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