Circuit board thermal relief pattern having improved electrical

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174252, 174257, 174262, 174263, 174266, H05K 100

Patent

active

054517206

ABSTRACT:
A circuit board having a thermal relief pattern for isolating heat generated during soldering of components thereon. The circuit board comprises (1) a substantially planar insulating substrate, the substrate having a via therethrough and (2) a substantially planar conductive layer located over the substrate, the via passing through the layer, the layer having a thermal relief pattern comprising a plurality of apertures located about the via, the plurality of apertures cooperating to restrict heat flow across the thermal relief pattern, each of the plurality of apertures having a boundary with the conductive layer free of discontinuities to inhibit edge effect electromagnetic resonance, the plurality of apertures defining a plurality of corresponding conductive bands in the conductive layer and between the plurality of apertures, the conductive bands cooperating to provide a predetermined minimum level of electrical conduction across the thermal relief pattern.

REFERENCES:
patent: 5264664 (1993-11-01), McAllista et al.
patent: 5326937 (1954-07-01), Watanabe

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