4. Metal fusion bonding
  5. Metallic heat applicator
  6. Adjustable or detachable head or tip

David P. Watson

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Method and apparatus for circuit board support during component

Metal fusion bonding – Metallic heat applicator – Adjustable or detachable head or tip
Patent

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Solder ball connections and assembly process

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Solder ball connections and assembly process

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Solder ball interconnected assembly

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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System and method for an open autonomy kernel (oak)

Electrical computers and digital processing systems: multicomput – Computer network managing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-462048

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