Solder ball connections and assembly process

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, 22818021, 22818022, 228254, 437183, H05K 336

Patent

active

056758898

ABSTRACT:
Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

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