Metal fusion bonding – Metallic heat applicator – Adjustable or detachable head or tip
Patent
1990-11-20
1992-03-03
Seidel, Richard K.
Metal fusion bonding
Metallic heat applicator
Adjustable or detachable head or tip
228106, 269 22, B23K 3700
Patent
active
050925105
ABSTRACT:
The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting. Finally, the requirement for providing a robotic manipulator and placement head capable of generating the substantial downward forces necesary to create a bond between a circuit board and an electronic component is eliminated by positioning the placement head and heated bonding tool proximate to the conductive leads of an electronic component and then forcefully urging the support fixture upward toward the heated bonding tool while maintaining the heated bonding tool in a fixed position.
REFERENCES:
patent: 3627190 (1971-12-01), Ramsey
patent: 3670396 (1972-06-01), Lindberg
patent: 3699640 (1972-10-01), Cranston
patent: 4013209 (1977-03-01), Angelucci
patent: 4017793 (1977-04-01), Haines
patent: 4607779 (1986-08-01), Burns
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patent: 4731151 (1988-03-01), Kaller
patent: 4733813 (1988-03-01), Le Meau
Sebonia, Stress Compensating Future for Lead Bonder, Western Electric Tech. Dig. No. 52, Oct. 1978, pp. 21-22.
Anstrom Joel R.
Holloway Robert A.
Hrehor, Jr. Robert D.
Watson David P.
Dillon Andrew J.
Hong Patty E.
International Business Machines - Corporation
Seidel Richard K.
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